What are the responsibilities and job description for the Clean Room Operator (Tropel) position at II-VI?
Basic Function of the Job: Performs a wide variety of production and R&D tasks related to the grinding, polishing, characterization, quality assurance, and packaging of silicon carbide (SiC) wafers. Calibrates and maintains polishing and characterization equipment. Provides support for crystal growth, fabrication, and characterization activities . Maintains inventory of supplies related to the processes. Supports ISO 9001 Quality System. Participates in Advanced Materials Environmental, Health and Safety activities. Responsible for the II-VI ESGP appraisal system as it relates to your own career and personal development.
This job description should not be construed to imply that these requirements are the only duties, responsibilities and qualifications for this job. Incumbents may be required to follow any additional related instructions, acquire job skills and perform other related work as required.
Organizational Relationships
Reports to:
Production Supervisor
Direct Reports:
None
Indirect Report (through Direct Reports):
None
Dotted Line (Matrix) Reports:
None
Primary Location:
Easton, PA
Job Requirements
Education:
- High School Diploma. College level courses in math, physics, metrology, or chemistry are preferred.
Experience:
- Prefer two years in a laboratory or production environment.
- Background in precision cutting, grinding, polishing and testing of optical or electronic materials.
- Experienced in the use of state-of-the-art precision measuring instruments.
- Experience with precision measurement methods and systems
- Ability to read and understand engineering drawings and process procedures
- Demonstrated ability to follow instructions and procedures closely while offering suggestions for continuous improvement
- Experience with networked PC based computer system (spreadsheets, Email, MRP systems)
Special Skills:
- Capable of training new employees.
- Must be willing to work evenings and weekends when required.
- Ability to work in a cross-cultural, team based environment
- Good interpersonal and communication skills
- Handle special assignments promptly and professionally
- Set a high standard of ethics, professionalism, and competency
- Demonstrates and promotes the II-VI Worldwide values:
- Customer First
- Honesty and Integrity
- Open Communications
- Teamwork
- Continuous Improvement and Learning
- Manage by the “Facts”
- A Safe, Clean and Orderly Workplace
Job Competencies:
Production Employee
Adaptability, Customer Focus, Personal Initiative, Problem Solving, Decision Making and Continuous Improvement, Professional and Technical Knowledge and Skills, Reliable and Dependable, Results Oriented, Safety & Environmental Awareness and Proactiveness, Teamwork and Positive Relationships, Work Standards
Job Element
Wt %
Specific Duty
1) Polishing
50%
- Performs polishing steps (namely, pre-polishing and final polishing) required for electrical \ electronic applications according to documented “best practice” methods
- Carries out polishing experiments as part of engineering-directed, contract or internally funded, process development programs
- Participates in the documentation of new and upgraded polishing procedures and specifications as they are readied for deployment as “best practices”
- Participates in the implementation and execution of a polishing process development plan.
- Supports the training of new employees assigned to the polishing activity (including employees on temporary assignment)
- Carries out a satisfactory, documented preventative maintenance program areas assigned to the polishing activity
- Maintains semiconductor production work areas.
2) Substrate Production
25%
- Trained on all process equipment. Equipment is operated to produce wafers that meet II-VI and customer specifications (Laser Marker, Polishers, Wafer Edge Grinder, and Wafer Cleaning Equipment).
- Perform fabrication tasks upon implementation of the process in the facility
- Trained on all characterization tools (orientation, defect identification, wafer etching, and the measurement of geometrical and material properties such as measurements of resistivity, warp and bow, x-ray etc…). Characterization tools are used to accurately and reliably collect data.
- Organizes and tracks customer orders and samples. Bottlenecks are identified and corrective actions taken when necessary.
- Manufactures and packages wafers to II-VI and customer specifications.
- Inspects finished substrates to assure quality requirements are met after each polishing step. Feedback is quickly provided to the team.
- Shipments to customers are made as planned and all required documentation is included with each shipment.
- Data is recorded and organized in a computerized database.
- Statistical Process Control (SPC) methods are used effectively to track the variability of critical process parameters and in measurements related to final product specifications.
- Process consumable inventories for substrate production are maintained.
- Communicates problems, results, and important issues to the process development team. Provides status reports, and alerts team when quality is jeopardized due to process variations.
- Constantly identifies ways to increase the efficiency, productivity, and quality of the SiC substrate manufacturing process.
3) Support Activities, Projects, and Equipment Maintenance
20%
- Maintains fabrication/characterization equipment when required. Executes calibration and preventative maintenance programs on schedule.
- Assists the Supervisor / Operations Manager in areas such as equipment selection and capacity expansion. Works with internal and external resources to commission and operate new equipment.
- Trains new employees when required.
- Provides assistance and support for all areas of the manufacturing process as required.
- Supports the ISO 9001 quality system, and updates operating procedures as required.
4) Human Resources / Administrative
3%
- An ESGP is co-developed and pursued.
- Accurate recording of work is maintained
- Company policy is followed regarding all safety, environmental and ergonomic requirements.
- Responsible for maintaining a quality work environment housekeeping standards.
- Cooperative in working with others.
- Adapts readily to changes in work caused by new requirements and/or situations.
- Effectiveness: Deals well with differences of opinion, manner and style; Seeks ideas from others; pursues simple solutions to everyday problems.
- Teamwork: Contributes to a cohesive working group; Demonstrates commitment to and enthusiasm for team goals; Demonstrates cooperation and coordination with all participants in the annual ESGP activity.
- Communication: Expresses ideas openly, accurately and succinctly in both oral and written forms; effectively listens to and assimilates information from others; presents organized trains of thought; assures timely and adequate information exchanges.
- Self-motivates, responsible for the II-VI ESGP appraisal system with regard to your own career and personal development.
5) Special Assignments
2%
- As assigned and directed by management.
Central Control Room Operator
United States Careers -
Bethlehem, PA
Laborer/Field Service Technician I
Clean Harbors -
Allentown, PA
Field service supervisor
Clean Harbors -
Allentown, PA
