Major Gift Officer, Sr. - Higher Ed. jobs in Vincennes, IN

Want to be part of our nation's highest national security priorities? The Engineering Operations department is seeking highly motivated mechanical engineers with a focus on die-level electronics packaging for our Odon, Indiana office, which is located just outside the Naval Surface Warfare Center Crane in Westgate.
This office supports a growing technological ecosystem, boasting over sixty high-tech companies, a leading government lab, cutting-edge academic research, and over 5,000 technical professionals. The facility is situated just south of Bloomington, Indiana, rated by Livability in '21 as one of the top places to live in the U.S. As a team member, you will be on the ground floor as we build out engineering capability to design next-generation strategic missile guidance and control systems that operate in hostile military and space environments, all while expanding our nation's preeminence in microelectronics for national security. You will be a key member of our nationally distributed experts, called upon by our government and academic partners to produce exquisite and robust solutions to some of our nation's most important technical challenges. We are seeking mechanical engineers at all levels for roles focused on electronics packaging in support of complex electromechanical system designs. The expectation is the person will grow into leadership roles and be a key interface between Indiana and other facilities. Specific responsibilities include: • Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, test, and documentation support • Develop die-level packaging solutions including proposing solutions for placement and control of sensing components requiring precise alignment to be maintained through shock, vibration, and thermal disturbances • Contribute to solving customer-driven problems as part of a multi-disciplinary team, contribute to ideation activities, and adapt appropriately to changes in requirements • Communicate effectively and openly with a multi-disciplinary program team members and program leadership, including non-technical personnel • Define an approach to independently solve technical problems and execute assignments under the oversight of program leadership • Identify technical and schedule risks associated with a design decision and communicate them to project leadership • Strong organization, planning and time management skills to achieve program goals Required Qualifications: The ideal candidate will have a BS or MS degree in electrical engineering, physics, nuclear engineering, mechanical engineering, materials science, or a related field with 2-10 years of experience. The candidate will have many of the skills below. • Team player able to work in a fast-paced environment with demonstrated ability to handle multiple competing tasks and demands • Experience designing in 3D CAD using SolidWorks and/or CREO • Experience with analysis tools such as ANSYS, COMSOL, and/or MatLab • Familiarity with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly • Familiarity designing/directing the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques • Familiarity with machine shop tools and processes, prototyping, and vendor coordination This Hybrid position is for on-site work at the Westgate facility with occasional travel to other locations and WFH a few days a week. Security Requirement: Applicants selected for this position will be required to obtain and maintain a U.S. Government security clearance.