How much does a Product Packaging Design Engineer II make in Sapporo, JP? The average Product Packaging Design Engineer II salary in Sapporo, JP is ¥6,107,723 as of March 26, 2021, but the range typically falls between ¥4,632,097 and ¥7,892,399. Salary ranges can vary widely depending on many important factors, including education, certifications, additional skills, the number of years you have spent in your profession. With more global market data that allows you to price your jobs around the world and compare job salaries across countries and cities on real-time compensation data, Salary.com helps you to determine your exact pay target.

Global Market Data
50TH(Median) ¥6,107,723 25TH ¥4,632,097 75TH ¥7,892,399

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Sapporo is a city located in the southwest part of Ishikari Plain and the alluvial fan of the Toyohira River, a tributary stream of the Ishikari River. It is part of Ishikari Subprefecture. Roadways in the urban district are laid to make a grid plan. The western and southern parts of Sapporo are occupied by a number of mountains including Mount Teine, Maruyama, and Mount Moiwa, as well as many rivers including the Ishikari River, Toyohira River, and Sōsei River. Sapporo has an elevation of 29 m (95 ft 2 in) Sapporo has many parks, including Odori Park, which is located in the heart of the cit...
Source: Wikipedia (as of 03/30/2021). Read more from Wikipedia
City, Country Compared to national average
City, Country Yokohama, JP Compared to national average
+ 6.4%
City, Country Tokyo Yokohama Rollup, JP Compared to national average
+ 10.8%
City, Country Osaka, JP Compared to national average
+ 5.9%
City, Country Nagoya, JP Compared to national average
+ 3.3%
City, Country Sapporo, JP Compared to national average
+ 1.4%
City, Country Kobe, JP Compared to national average
+ 5.7%
Employees with Product Packaging Design Engineer II in their job title in Tokyo Yokohama Rollup, JP earn an average of 10.8% more than the national average.

Understand the base salary paid range for a Product Packaging Design Engineer II in Sapporo, JP

Average Base Salary

Core compensation

4632097
7892399
6107723
The chart shows the base salary for Product Packaging Design Engineer II in Sapporo ranges from ¥4,632,097 to ¥7,892,399 with the average base salary of ¥6,107,723. The basic salary is the employee minimum income you can expect to earn in exchange for your time or services. This is the amount earned before adding benefits, bonuses, or compensation. The base salary of the Product Packaging Design Engineer II may get paid difference by industry, location, and factors.