ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer II Salary in the United States

How much does an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer II make in the United States? The average salary for Product Packaging Design Engineer II at companies like ESPEY MFG & ELECTRONICS CORP in the United States is $76,490 as of May 31, 2019, but the range typically falls between $69,890 and $84,690. Salary ranges can vary widely depending on many important factors, including education, certifications, additional skills, the number of years you have spent in your profession. With more online, real-time compensation data than any other website, Salary.com helps you determine your exact pay target.  View the Cost of Living in Major Cities

What is an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer II?

The Product Packaging Design Engineer II tests, analyzes, and selects materials for packaging based on durability and cost effectiveness. Designs product packaging to ensure product integrity and appeal under varying shipping and display conditions. Being a Product Packaging Design Engineer II typically requires a bachelor's degree. Evaluates the effectiveness of new package designs and ensures compliance with all requirements and regulations. In addition, Product Packaging Design Engineer II typically reports to a supervisor or manager. Being a Product Packaging Design Engineer II gains exposure to some of the complex tasks within the job function. Occasionally directed in several aspects of the work. Working as a Product Packaging Design Engineer II typically requires 2 to 4 years of related experience. (Copyright 2019 Salary.com)

Understand the total compensation opportunity for an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer II, base salary plus other pay elements

Average Base Salary

Core compensation

 
 
 
$69,890
$84,690
$76,490

Average Total Cash Compensation

Includes base and annual incentives

 
 
 
$74,390
$89,190
$80,190
These charts show the average base salary (core compensation), as well as the average total cash compensation for Product Packaging Design Engineer II in companies like ESPEY MFG & ELECTRONICS CORP in the United States. The base salary for Product Packaging Design Engineer II in companies like ESPEY MFG & ELECTRONICS CORP range from $69,890 to $84,690 with the average base salary of $76,490. The total cash compensation, which includes bonus, and annual incentives, can vary anywhere from $74,390 to $89,190 with the average total cash compensation of $80,190.
Job Openings for ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer II
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