ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer III Salary in the United States

How much does an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer III make in the United States? The average salary for Product Packaging Design Engineer III at companies like ESPEY MFG & ELECTRONICS CORP in the United States is $95,200 as of May 31, 2019, but the range typically falls between $87,700 and $102,900. Salary ranges can vary widely depending on many important factors, including education, certifications, additional skills, the number of years you have spent in your profession. With more online, real-time compensation data than any other website, Salary.com helps you determine your exact pay target.  View the Cost of Living in Major Cities

What is an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer III?

The Product Packaging Design Engineer III tests, analyzes, and selects materials for packaging based on durability and cost effectiveness. Designs product packaging to ensure product integrity and appeal under varying shipping and display conditions. Being a Product Packaging Design Engineer III typically requires a bachelor's degree. Evaluates the effectiveness of new package designs and ensures compliance with all requirements and regulations. In addition, Product Packaging Design Engineer III typically reports to a manager or head of unit/department. Being a Product Packaging Design Engineer III contributes to moderately complex aspects of a project. Work is generally independent and collaborative in nature. Working as a Product Packaging Design Engineer III typically requires 4 to 7 years of related experience. (Copyright 2019 Salary.com)

Understand the total compensation opportunity for an ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer III, base salary plus other pay elements

Average Base Salary

Core compensation

 
 
 
$87,700
$102,900
$95,200

Average Total Cash Compensation

Includes base and annual incentives

 
 
 
$92,100
$111,200
$99,200
These charts show the average base salary (core compensation), as well as the average total cash compensation for Product Packaging Design Engineer III in companies like ESPEY MFG & ELECTRONICS CORP in the United States. The base salary for Product Packaging Design Engineer III in companies like ESPEY MFG & ELECTRONICS CORP range from $87,700 to $102,900 with the average base salary of $95,200. The total cash compensation, which includes bonus, and annual incentives, can vary anywhere from $92,100 to $111,200 with the average total cash compensation of $99,200.
Job Openings for ESPEY MFG & ELECTRONICS CORP Product Packaging Design Engineer III
... Packaging Design, Packaging Program Management & Content and Packaging Manufacturing Readiness. ... Experience using SolidWorks is a plus. · Understanding of product development and configuration ...
ZipRecruiter - 2 days ago
MKS2 - Fairfax , VA
Responsible for the design, development, and configuration of software systems to meet market and ... Tests, debugs, and refines the software to produce the required product. · Creates coded unit ...
ZipRecruiter - 3 days ago
Sikorsky Aircraft Corporation - Sunnyvale , California
... design and build solutions to some of the world's hardest engineering problems. Do you want to be ... products? We provide the resources, inspiration and focus--if you have the passion and courage to ...
Neuvoo - 4 days ago
Multi-year opportunity with a full benefits package POSITION OVERVIEW: This contract Software ... The role of this position is to support the design, development, and management of application ...
ZipRecruiter - 3 days ago
Barry Wehmiller - Portland , OR
... production of complete issue-for-permit and issue-for-construction drawing packages in an A ... Engineer or Architect
Upward.net - 5 days ago
... III (SWE3) at EDT will design, code, test, and maintain software associated with EDT products at ... testing, packaging, product delivery, and maintenance.Work closely with customers to support ...
LinkedIn - 4 days ago

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