Understanding of PCB construction and design, transmission line theory, I/O circuit technology analysis and high-speed Gbps serial data interface signal integrity challenges.
March 05, 2020
Provide recommended connector pin-out configuration for optimized signal integrity performance.
March 10, 2020
Recommend package layer stack-up, material, impedance targets and net assignments for signals.
March 13, 2020
Required experience and working knowledge of PCB board level simulation tools like Cadence System SI, Speed 2000, Power SI, Specctraquest, Sigxp etc.
March 21, 2020
Create low cost, short lead time testing methods that predict high speed material system performance to allow for quicker response to R&D testing.
March 29, 2020
Complete package extractions (signal and power) using Cadence tools (PowerSI) and Ansys tools (Electronics Desktop, HFSS, SiWave).
April 10, 2020
Design, layout, and characterize high speed Integrated SerDes circuits in various channel environments spanning multiple PCBs and high speed connectors.
April 27, 2020