What are the responsibilities and job description for the Electronics Packaging High Speed IO Technology Lead position at AMD?
WHAT YOU DO AT AMD CHANGES EVERYTHING
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
The Role
In this role you will lead the development of next generation packaging for high speed signaling.
The Person
The ideal candidate will be highly organized and present well to executive teams. Self motivated and able to work independently.
Responsibilities
MS or PHD in related engineering field
LOCATION: Austin, TX
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded. Underpinning our mission is the AMD culture. We push the limits of innovation to solve the world’s most important challenges. We strive for execution excellence while being direct, humble, collaborative, and inclusive of diverse perspectives.
AMD together we advance_
The Role
In this role you will lead the development of next generation packaging for high speed signaling.
The Person
The ideal candidate will be highly organized and present well to executive teams. Self motivated and able to work independently.
Responsibilities
- Lead the development of next-generation low-loss substrate materials and routing strategies
- Partner with signal integrity and sockets teams to develop and deploy next-generation socket and connector technologies
- Lead the definition of future silicon bridge and silicon interposer advanced packaging technologies
- Define and drive a long-term roadmap of these and other high speed IO technologies. Partner with signal integrity teams to evaluate these technologies for use on future products, then drive mechanical, thermal, and reliability evaluations of leading options.
- Lead the design, fabrication, and measurement of test vehicles to demonstrate new technologies and prepare them for deployment in high-volume products.
- Manage Packaging organization interactions with IP teams to ensure HSIO design is compatible with future packaging technologies.
- Manage academic research partnerships in the area of HSIO (high speed I/O) packaging technologies
- Direct experience in flip chip packaging, including substrates and advanced packaging technologies.
- Direct experience with passive measurement techniques for electronics packaging.
- Familiarity with signal integrity analysis for electronics packaging.
MS or PHD in related engineering field
LOCATION: Austin, TX
At AMD, your base pay is one part of your total rewards package. Your base pay will depend on where your skills, qualifications, experience, and location fit into the hiring range for the position. You may be eligible for incentives based upon your role such as either an annual bonus or sales incentive. Many AMD employees have the opportunity to own shares of AMD stock, as well as a discount when purchasing AMD stock if voluntarily participating in AMD’s Employee Stock Purchase Plan. You’ll also be eligible for competitive benefits described in more detail here.
AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
Salary : $156,640 - $234,960
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