What are the responsibilities and job description for the Packaging Engineer position at Broadcom Inc.?
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Job Description:Description:
Join this team focused on RF Modules for the Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Wireless Semiconductor Division (WSD) of Broadcom. You will be working directly with R&D Project Managers, Front-end and Back-end Manufacturing Teams, and define and qualify enabling Packaging technologies for these products.
Responsibilities:
- Development of advanced packaging technologies for RF SiP (system in package) applications - SMT, wirebonding, molding, laser marking, laser ablation, solder ball attach, strip grinding, singulation, EMI shielding, and other assembly processes
- Create, conduct, and analyze Design of Experiments (DOE) for development and sustaining activities
- Writing of assembly specifications, reports, and technology definition documentation
- Team cross-functionally with design, NPI, quality and reliability, manufacturing teams and support new technology integration into products
- Support selection, and qualification of assembly suppliers
- Understand PCB and assembly process details, SPC, Control plans, OCAPs, FMEAs, PCN, and Quality metrics. Conduct audits, benchmarking and drive best practice methodologies to proactively prevent quality excursions as the technology ramps
- Sketch and participate in value engineering and cost reduction plans
Requirements:
- Masters Degree in Mechanical / Materials / Chemical Engineering or other related disciplines and 10 years of experience in electronics packaging in related environments, SiP, DSM, PoP, flipchip BGA, wafer level CSP, etc. Or PHD in Mechanical / Materials / Chemical Engineering or other related disciplines and 7 years of experience in electronics packaging in related environments, SiP, DSM, PoP, flipchip BGA, wafer level CSP, etc.
- Experience in process engineering, product integration or quality management at tier 1 assembly sub-contractors
- Solid technical understanding of full range of semiconductor packaging materials, material interactions, processes, dominant failure mechanisms and analytical techniques
- Good knowledge of packaging industry standards (IPC, JEDEC, IEEE, ISO, ANSI)
- Understanding of package qualification and reliability methods and failure analysis is required.
- Understanding of statistics, control methodology, FMEA, analytical trouble shooting in a factory environment is required
- Familiarity with PCB design and layout tools preferred
- Excellent communication skills
- Strong skill in AutoCAD is desired
- Willingness to travel internationally, typically once per quarter
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $126,000 - $210,000.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Broadcom Inc. is committed to creating a diverse work environment and is proud to be an equal opportunity employer.
Salary : $126,000 - $210,000