Mechanical Design Engineer I

WHY HONEYWELL? 

Honeywell changes the way the world works. 

For more than 130 years, we have solved the toughest customer challenges through a rare combination of our industrial expertise and our innovations in groundbreaking software and technology, and industry-leading automation. 

This perfection is built on a foundation of inclusion, diversity and driving a performance culture that values integrity and ethics. 

Are you ready to help us make the future? 

ABOUT THE ROLE

As a Mechanical Design Engineer I here at Honeywell Aerospace Technologies, you will be a key contributor to the design and development of cutting-edge navigation and sensor solutions for a variety of applications. Your knowledge of Mechanical Engineering principles will ensure the delivery of innovative and high-performance mechanical designs. You will report directly to our Mechanical Engineering Manager, and you will work out of our Minneapolis, MN location on a Hybrid (3 on-site) work schedule.

In this role, you will be critical in the mechanical design process, ensuring the delivery of high-quality and reliable navigation and sensor products. Your responsibilities will include the mechanical design and drafting of our navigation and sensor products using CREO Parametric. You will also have the opportunity to conduct Finite Element Analysis to validate designs, performing thermal and structural analysis to optimize product performance using NX Simcenter.


KEY RESPONSIBILITIES

• Utilize CREO Parametric software for 3D modeling, design, and drafting of Printed Board Assemblies, mechanical enclosures, and assemblies.
• Conduct Finite Element Analysis (thermal and structural) using NX Simcenter to ensure adequate electronics packaging and Printed Board Assembly performance.
• Collaborate with cross-functional teams to define mechanical requirements and specifications.
• Design, develop, and analyze complex navigation and sensor components and assemblies.
• Stay updated with the latest industry trends and technologies in mechanical design, Printed Board Assembly design, and electronics packaging.

Must be a US Citizen due to contractual requirements