What are the responsibilities and job description for the Head of Semiconductor Manufacturing position at Lumotive?
Lumotive’s transformative optical semiconductors are enabling Lidar 2.0 for consumer, mobility, and industrial markets. The company’s Light Control Metasurface (LCM™) optical semiconductors utilize revolutionary, patented beam-steering technology to deliver an unprecedented combination of best-in-class performance, cost, reliability, and size. Lumotive’s LCMs enable the industry’s first software-defined lidar with advanced perception capabilities. The company has received measurable industry acclaim with inclusion in the following rankings: Sensors Converge/Fierce Electronics 2021 Startup of the Year, Built In Seattle’s Best Small Companies to Work For, JMP Securities Efficient Fifty list of the most interesting private companies in industrial and energy technology, and EE Times’ Silicon 100: Emerging Startups to Watch. Lumotive’s LCM technology was recently recognized with two CES 2022 Innovation Awards, a 2022 SPIE PRISM Award, a 2022 Business Intelligence Group "Excellence in Artificial Intelligence" Award, and a prestigious Edison Award. Investors include Bill Gates, Samsung Ventures, MetaVC Partners, and Quan Funds.
As Head of Semiconductor Manufacturing you will be responsible for all aspects of manufacturing of Lumotive's core product, the solid-state Light Control Metasurface beam steering chips.
- Lead customized process development efforts with internal process engineering team and in coordination with partner foundries
- Transition process from development phase to volume production
- Drive yield ramp up, quality, and reliability
- Work closely with product engineering and photonics teams to match product requirements with manufacturing constraints
- Be responsible for supply chain optimization, cost modeling of product, and negotiations with key vendors
- Responsibility to back end manufacturing including packaging and production test
- Expand and lead manufacturing organization within Lumotive
- Deep background in CMOS process engineering, with particular focus on copper damascene back end of line
- Background in transitioning semiconductor products and technology from R&D to volume production
- Experience in all aspects of semiconductor manufacturing, including wafer fab, packaging, and test
- Experience with advanced packaging like multi-chip module assembly
- Preferred experience with monolithic integration of novel semiconductor technologies with conventional CMOS
Additional Information
All your information will be kept confidential according to EEO guidelines.
