Wafer Fabrication Operator manufactures wafers under direct supervision. Performs the basic processes of production, such as: baking, aligning, inspecting, etching, and cleaning the wafers. Being a Wafer Fabrication Operator ensures the quality of final product and provides reports to management. May require a high school diploma or its equivalent. Additionally, Wafer Fabrication Operator typically reports to a supervisor or manager. The Wafer Fabrication Operator possesses a moderate understanding of general aspects of the job. Works under the close direction of senior personnel in the functional area. May require 0-1 year of general work experience. (Copyright 2024 Salary.com)
Description
Teledyne Judson Technologies (TJT) is a global leader in detectors from the Visible to VLWIR spectrum, offering an extensive range of single element infrared detectors.
Two dimensional focal plane arrays (InGaAs, InSb, and HgCdTe) and Integrated Dewar Cooler Assemblies (IDCA) complement our detector portfolio.
Military, space, and commercial markets employ our detectors, which are recognized for high performance. Located near Philadelphia, with easy access to the Northeast corridor, TJT offers a small company atmosphere, while enjoying the benefits of being part of a larger corporation.
The Wafer Fabrication Technician - back end will work in teams in clean room, performing well-defined processes required in the manufacture of infrared photodetectors and focal plane arrays (FPAs).
$5K Sign On Bonus
Essential Duties and Responsibilities
Carry out specific procedures under the direction of an engineer or supervisor.
Assist process engineers as needed in performing experimental processes.
Operates appropriate production equipment as needed in the manufacture of IR photodetectors and FPAs.
Will keep daily records and / or logs as required.
Other duties as assigned.
Education and Experience
High school diploma a minimum; science training a plus
Experience in wafer and device handling desirable
Minimum 3 years experience desirable
Knowledge, Skills and Abilities
Exceptional manual dexterity in handling fragile semiconductor wafers and small precision tools such as tweezer and probes.
Hands-on experience in wafer probing, chip dicing or chip scribing and inspection desirable
Hands-on experience in operating back-end wafer-fab related equipment such as dicing saw, scriber, wafer prober desirable
Great attention to details; following standard instructions or procedures.
Excellent verbal and written communication skills
Basic computer proficiency using Microsoft Office Word and Excel
Displays exemplary ethics and business conduct and performs work cognizant of safe work practices
Citizenship Requirements
Due to the type of work at the facility and certain access restrictions, successful applicants must be a U.S. Citizen.
A Competitive Salary & Benefits Package
Excellent Health, Dental, Vision
Paid Vacation Time
Paid Sick Time
Life Insurance Benefits
Paid Holidays
401(k) Eligibility
Employee Stock Purchase Plan
Educational Tuition Reimbursement
Employee Fun Events throughout the year
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders.
Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Last updated : 2024-05-06
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