Principal HBM Physical Design Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

As an HBM Physical Design Architect, you will be responsible for the design & development of next generation HBM DRAM products. You will be part of a highly cross-functional team of technical subject matter experts collaborating closely with a global team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best in class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.

Responsibilities Will Include, But Are Not Limited To

• Defining effective design partitioning and circuit architecture to convert fully custom and asynchronous designs to fully synthesizable and synchronous designs.
• Working with external customers and IP vendors as well as internal design teams to integrate IP blocks into a fully functioning design.
• Evaluating and driving optimization of power, performance, and area of key design blocks across various process nodes.
• Pathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analysis.
• Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.
• Engage with Customers to support issues with current HBM architectures and identify opportunities to innovate on future HBM solutions.
• Focus areas within team will include memory array architectures, on-die and off-die high speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies and thermal modeling.
  
  

Successful Candidates For This Position Will Have

• Experience and expertise across the various areas of physical design, including timing closure and STA, clock tree synthesis, floor planning, and power/performance/area optimization.
• Experience with industry standard physical design tools and working in a foundry design environment.
• Familiarity with DRAM operation and JEDEC specifications, preferably with HBM product family.
• In depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies
• Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership
• Strong track record of innovation and problem-solving in high-performance memory development
• Bonus - Good understanding of Memory subsystem operation in high-performance computing applications
• Bonus - Prior experience with DRAM product bring-up and debug
• Bonus - Prior experience with package technologies (TSV, hybrid bonding, interposers, etc)
  
  

Required Experience

• BSEE or greater
• 10 years of relevant Engineering or Design Engineering experience
  
  

Job title and level can scale depending on experience and qualifications

The US base salary range that Micron Technology estimates it could pay for this full-time position is:

$123,000.00 - $298,000.00

Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Salary : $123,000 - $298,000