Senior Microelectronics Packaging Engineer

allegromicro
Manchester, NH Full Time
POSTED ON 9/4/2024 CLOSED ON 9/26/2024

What are the responsibilities and job description for the Senior Microelectronics Packaging Engineer position at allegromicro?

The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business.  From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success.

 

As part of our innovation, we recognize that our team members are unique and that our work locations must be adaptable.  At Allegro we flex. Flex@Allegro is our approach to hybrid work that empowers managers and their team members to decide where and when work will be done. Ask what Flex@Allegro can mean for you. 

Senior Microelectronics Packaging Engineer at Allegro MicroSystems, LLC in Manchester, NH

Duties:

  • Perform design and development of new package, process flow and materials in support of Sensor Business Unit and Power IC Business Unit.
  • Create AutoCAD drawings and 3D models and specifications for new packages.
  • Create DFMEA and other necessary documentation to fulfill APQP requirements.
  • Support qualification and transition of new package to mass production.
  • Manage project schedule and deliverables and maintain the documents in SharePoint.
  • Work closely with cross functional teams on new package development and optimization of current packages.
  • Work closely with in house assembly sites AMPI and AMTC, as well as subcontractors and suppliers for new package development.

Requirements:

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Industrial and Systems Engineering and 5 years of experience with: AutoCAD; 3D design software such as one of the following: Autodesk Inventor, SolidWorks, Pro-E; and using simulation software such as one of the following: ANSYS, SolidWorks Simulation, Autodesk Simulation.  In the alternative, will also accept either: 1) Master’s degree in the same fields and 3 years of same experience; or 2) Ph.D. in the same fields and 6 months of same experience; or 3) Ph.D. in the same fields including coursework applicable to above-mentioned experience.

Hybrid office/home work schedule.

Apply to: mrheaume@allegromicro.com, code HH24.

#LI-DNI

At Allegro, we are committed to providing a harassment-free environment of mutual respect to fuel innovation through inclusive thought collaboration.  Allegro is an Equal Opportunity Employer and does not discriminate on the basis of race, religion, color, sex, gender identity, sexual orientation, age, physical or mental disability, national origin, veteran status, parental status, or any other basis covered by appropriate law.  Allegro makes hiring decisions based solely on qualifications, merit, and business needs at the time.


Eligible applicants must reside in a state where Allegro currently has an office location: This includes New Hampshire, Massachusetts, Texas, Oregon, and Michigan. Certain positions (such as field sales roles) may be exempt from this requirement.

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