Contribute to our ASIC package design and verify structural integrity by using analytical methods, finite element models/simulations and other analysis tools.
January 14, 2023
Lead premium and promotions process.
February 05, 2023
Collaborate internally and externally, and leverage supplier resources against key initiatives.
February 17, 2023
Create Finite Element Analysis (FEA) models by research, experimentation, hands-on testing and tear down of failed products.
March 06, 2023
Lead or support plant trials and Pilot Plant production activities.
March 13, 2023
Drive the collaboration with multi-functional internal teams, outsourced assembly and tests (OSATs) and material suppliers to deliver chip package solution for production.
March 20, 2023
Manage and retain packaging standards.
May 18, 2023