Wafer Grinding & Dicing Co Salary

Wafer Grinding & Dicing Co Salary

How much does the Wafer Grinding & Dicing Co Pay for employees?

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As of August 2026, the average hourly salary for employees at Wafer Grinding & Dicing Co in the United States is $54. This translates to an approximate annual wage of $113,001. Salaries at Wafer Grinding & Dicing Co typically range from $48 to $61 hourly, reflecting the diverse roles and experience levels within the company. Wafer Grinding & Dicing Co’s salaries are influenced by a wide range of factors including job role, department, years of experience, and location.
DISCLAIMER: The salary range presented here is an estimation that has been derived from our proprietary algorithm. It should be noted that this range does not originate from the company's factual payroll records or survey data.

How Much Does Wafer Grinding & Dicing Co Pay for Different Roles?

Explore detailed salary information for specific jobs at Wafer Grinding & Dicing Co. The table below outlines the annual salary ranges for popular roles within the company, helping you benchmark potential earnings. Use 'View by Card/Table' option to find the data most relevant to your career path.
DISCLAIMER: The salary range presented here is an estimation that has been derived from our proprietary algorithm. It should be noted that this range does not originate from the company's factual payroll records or survey data.
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Current Job Openings at Wafer Grinding & Dicing Co

Ready for your next career move? Explore current job openings at Wafer Grinding & Dicing Co. Use the search tool below to find available positions by title and location and apply directly to start your career.

Is Wafer Grinding & Dicing Co’s Pay Competitive? Salary Benchmarking Analysis

How does Wafer Grinding & Dicing Co’s compensation stack up against the market? This analysis visualizes their hourly average salary compared to its industry benchmark and key peer companies.
Peer Company & Industry Benchmarking
180k
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Average Salary ($/year)
Wafer Grinding & Dicing Co
MFG Durable
Hydroswing
Atmosic Technologies Inc
Industry Comparison
Our data shows that, on average, compensation at Wafer Grinding & Dicing Co is below the average for the U.S. MFG Durable industry by approximately 7%. This positioning suggests their pay is below the market average within their sector.
Peer Company Comparison
To provide a broader market perspective, we compared Wafer Grinding & Dicing Co average annual salary with several similar companies. Wafer Grinding & Dicing Co average salary of $113,001 is higher than Hydroswing, which has an average salary of $96,683. It is lower than Atmosic Technologies Inc, with their average salary at $115,290. This places Wafer Grinding & Dicing Co in a mid-range position among its peers.
See Your True Competitors
The companies behind the question marks could be hiring your best people. Don't operate with incomplete data. Unlock your full competitive view with Salary.com for Business to precisely benchmark salaries, benefits, and more against your true competitors.

Companies Similar to Wafer Grinding & Dicing Co and Their Hourly Pay Rates

Explore companies in the same industry to compare average salaries, benefits, and career opportunities with those at Wafer Grinding & Dicing Co. Click a company name to learn more.

Employee Reviews: Working at Wafer Grinding & Dicing Co

Considering a career at Wafer Grinding & Dicing Co? Explore authentic employee reviews to learn about the work environment, career growth opportunities, pay transparency and benefits. These first-hand insights can help you set realistic compensation expectations and make informed career decisions.
I’ve stayed because the culture values hard work, but doesn’t burn you out. Work conditions are generally stable, with decent safety measures and adequate equipment. What makes this manufacturer special is its ability to combine large-scale production with attention to detail. Pay is fair, and it is somehow outstanding.
Commented in April 05, 2025
19
2
Good place to gain experience, though not particularly innovative or fast-moving in terms of process improvements. The tasks are repetitive, but manageable. Equipment updates happen often. Moreover, there's a strong culture of teamwork and mutual respect that makes coming to work a pleasant experience. Equipment is mostly reliable, but support during breakdowns can lag. You feel appreciated for yo...
Commented in November 13, 2024
40
1
Flexibility in shifts depends on management, leading to mixed experiences. The company provides a stable work environment with standard safety practices, though enforcement can sometimes be inconsistent. Training is available and it is somehow tailored or frequent. I've been with this manufacturer for years, and the stability is fantastic. Working for this manufacturing leader has been incredibly ...
Commented in May 05, 2024
41
1
The company’s investment in technology and automation has significantly improved efficiency. The career growth opportunities are outstanding. Management provides regular updates, though feedback is usually surface-level. Communication from management is formal but sometimes lacks transparency.
Commented in January 01, 2024
18
3

Wafer Grinding & Dicing Co Overview

Website
www.wafergrind.com
Founded In
Data pending, update soon.
Employees
25 - 50 employees
Industry
MFG Durable
Headquarter Address
925 Berryessa Rd San Jose California CA 95133
Revenue
$5 Million - $10 Million
Phone Number
+1 4084512000
Social Media
About Wafer Grinding & Dicing Co
Grinding & Dicing Services Inc (GDSI) provides wafer thinning and dicing services to the IC industry for critical post-fabrication process requirements. GDSI is headquartered in San Jose, California.

What Benefits Does Wafer Grinding & Dicing Co Offer Beyond Salary?

A competitive compensation package is more than just a salary. Wafer Grinding & Dicing Co offers a comprehensive benefits package designed to support your health, financial future, and overall well-being. Below are the most common key benefits:
Social Security
401(K)
Disability
Healthcare
Pension
Time Off (days)
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What Is the Cost of Living Near San Jose?

Understanding the cost of living near San Jose is key to truly evaluating a salary offer or your current compensation at Wafer Grinding & Dicing Co.
San Jose's Cost of Living Index is approximately 214.5 (114.5% more expensive than US average; 53.4% more than CA average). Heart of Silicon Valley, astronomical housing costs, high transportation, and high prices for almost everything. When planning your budget based on a salary from Wafer Grinding & Dicing Co, consider these typical monthly expenses:
Expense Category Estimated Monthly Cost Key Considerations / Notes
Housing (1-BR Apt Rent) $2,800 - $4,500+ A significant portion of Wafer Grinding & Dicing Co salary. Location choices impact this heavily.
Utilities (Basic) $180 - $300 Electricity, Heating, Cooling, Water etc.
Public Transportation $80 (VTA monthly pass) Essential for most commuters; car ownership is costly.
Groceries (Single Person) $500 - $800 Can be higher with more dining out or specialty stores.
Personal & Leisure $550 - $1,100+ Dining out, entertainment, shopping. Highly variable.
Healthcare (Individual) $400 - $780+ Varies significantly by plan & employer contribution.
Subtotal (Excluding Taxes) $4,510 - $7,480+ This subtotal does not include income taxes (federal, state, local), which can significantly impact your take-home pay.

FAQs of Wafer Grinding & Dicing Co

1. How much does a Wafer Grinding & Dicing Co employee make?

Wafer Grinding & Dicing Co pays its employees an average of $54 per hour. The average salary at Wafer Grinding & Dicing Co range from $48 to $61 per hour. It's important to remember that these are overall averages, actual salaries vary significantly based on specific job titles, years of experience, skills, and location.

2. Which similar company tend to pay more or less than Wafer Grinding & Dicing Co?

The salary at Wafer Grinding & Dicing Co is higher than the similar company. The average annual salary at Wafer Grinding & Dicing Co is $113,001, or an hourly wage of $54, in comparison to Hydroswing which pays $96,683 per year or $46 per hour.

3. How much does a President typically earn at Wafer Grinding & Dicing Co?

A President at Wafer Grinding & Dicing Co typically earns an average hourly base salary of around $421, with a general range of $322 to $529.

4. Do employees with advanced degrees (Master's, PhD) earn more at Wafer Grinding & Dicing Co?

In many roles at Wafer Grinding & Dicing Co, particularly those requiring specialized knowledge or research capabilities (e.g., certain engineering, scientific, or financial roles), an advanced degree like a Master's or PhD can lead to a higher starting salary and faster career progression, thus higher earnings. However, for some roles, direct experience and skills might be valued as much or more than an advanced degree. The impact varies by field and specific job requirements.

5. How does the cost of living near San Jose affect the perceived value of a Wafer Grinding & Dicing Co salary?

San Jose's Cost of Living Index is approximately 214.5 (114.5% more expensive than US average; 53.4% more than CA average). This significantly impacts the purchasing power of a salary from Wafer Grinding & Dicing Co based there. Our "Cost of Living Insights for San Jose" module details this impact, helping you assess the 'real feel' value of your compensation.

6. What kind of benefits does Wafer Grinding & Dicing Co typically offer employees?

Wafer Grinding & Dicing Co generally offers a range of employee benefits designed to support their workforce's health, financial well-being, and work-life balance. Comprehensive health insurance (medical, dental, vision), a 401(k) retirement savings plan (often with a company match), paid time off (PTO), and potentially disability and life insurance are included. For a more detailed list of benefits, please see our "Employee Benefits at Wafer Grinding & Dicing Co" section on this page.

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