Lead Packaging Engineer Salary at Ips Packaging BETA

Salary Overview

Job Skills

Company Info

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How much does an Ips Packaging Lead Packaging Engineer make?

Paid Annually Paid Monthly Paid Semimonthly Paid Biweekly Paid Weekly Paid Hourly
25% $126,027 10% $113,349 90% $162,213 75% $151,647 $140,036 50%(Median)
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As of July 2026, the average salary for Lead Packaging Engineer at Ips Packaging in the United States is $140,036 per year, which is equivalent to an hourly rate of approximately $67. Most salaries for this position fall within the range of $126,027 to $151,647 annually.

The exact salary offered will depend on factors such as a candidate's years of experience, skills, department and location.

DISCLAIMER: The salary range presented here is an estimation that has been derived from our proprietary algorithm. It should be noted that this range does not originate from the company's factual payroll records or survey data.

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Key Skills & Their Impact on a Lead Packaging Engineer at Ips Packaging?

To succeed and maximize your earning potential as a Lead Packaging Engineer at Ips Packaging, a specific set of skills is crucial. The competencies listed below are highly valued. Explore the skills that can boost your compensation.

Skills Level of importance Description
Packaging
Preparing products through wrapping or bottling to protect the goods from damages during transportation and storage.
Packaging Design
Creating graphics and physical containers of a product to protect it from damage and tampering.
Container
Container is an object used for or capable of holding, esp for transport or storage, such as a carton, box, etc.
Project Management
Project management is the application of processes, methods, skills, knowledge and experience to achieve specific project objectives according to the project acceptance criteria within agreed parameters.
Packaging Engineering
Packaging engineering, also package engineering, packaging technology and packaging science, is a broad topic ranging from design conceptualization to product placement.
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Lead Packaging Engineer Career Path and Growth Opportunities

Understanding the career path for a Lead Packaging Engineer can help you plan long-term professional growth. Below is a typical career progression for a Lead Packaging Engineer, highlighting common next-step roles and opportunities for increased responsibility and compensation.

Base Salary $162,464
Total Compensation $188,537
Base Salary $138,657
Total Compensation $166,607
Base Salary $176,557
Total Compensation $220,808

IPS Packaging Overview

Website
www.ipack.com
Founded In
1976
Employees
100 - 200 employees
Industry
MFG Durable
Headquarter Address
10 Jack Casey Ct Fountain Inn South Carolina SC 29644
Revenue
$10 Million - $50 Million
Phone Number
+1 8648621500
Social Media
About IPS Packaging
IPS Packaging, founded in 1976 and headquartered in Fountain Inn, South Carolina, is a distributor and manufacturer of packaging supplies and equipment.

Companies Similar to Ips Packaging

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FAQ about Salary and Jobs at Ips Packaging

FAQ 1: How much does Ips Packaging pay per hour?
The average hourly pay is $67. The salary for each employee depends on several factors, including the level of experience, work performance, certifications and skills.
FAQ 2: What is the highest salary at Ips Packaging?
According to the data, the highest approximate salary is about $151,647 per year. Salaries are usually determined by comparing other employees’ salaries in similar positions in the same region and industry.
FAQ 3: What is the lowest pay at Ips Packaging?
According to the data, the lowest estimated salary is about $126,027 per year. Pay levels are mainly influenced by market forces, supply and demand, and social structures.
FAQ 4: What steps can an employee take to increase their salary?
There are various ways to increase the wage. Level of education: An employee may receive a higher salary and get a promotion if they obtain advanced degrees. Experience in management: an employee with supervisory experience can increase the likelihood to earn more.

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